28 V thermal impedance HBT with 20 W CW output power

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 1997, Pages 137-140

  Hill, Darrell ^a   Kim, Tae ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN OF SOLIDS; FLIP CHIP DEVICES; HEAT RESISTANCE; METALLORGANIC CHEMICAL VAPOR DEPOSITION; POWER ELECTRONICS; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE MANUFACTURE;

LOW THERMAL IMPEDANCE (LTI) TECHNOLOGY; MICROWAVE POWER DEVICES;

HETEROJUNCTION BIPOLAR TRANSISTORS;

EID: 0030685289     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)