Model order reduction of linear and nonlinear 3D thermal finite-element description of microwave devices for circuit analysis

International Journal of RF and Microwave Computer-Aided Engineering

Volumn 15, Issue 5, 2005, Pages 398-411

  Sommet, Raphaë ^a,c   Chang, Christophe ^a   Quéré, Raymond ^a   Duême, Philippe ^b,d,e  

^a IUT GEII   (France)

^b THALES   (France)

^c CNRS   (France)

^d THALES RESEARCH AND TECHNOLOGY   (France)

^e THALES AVIONICS   (France)

Author keywords

3d thermal simulation; High power amplifier; Kirchoff transformation; Nonlinear model; Pulsed measurements; Reduction technique; Ritz vector; SPICE subcircuit; Transient temperature simulation

Indexed keywords

3D THERMAL SIMULATION; HIGH-POWER AMPLIFIERS; KIRCHOFF TRANSFORMATION; NONLINEAR MODEL; PULSED MEASUREMENTS; REDUCTION TECHNIQUE; RITZ VECTOR; SPICE SUBCIRCUIT; TRANSIENT TEMPERATURE SIMULATION;

COMPUTER SIMULATION; ELECTRIC CURRENTS; ELECTRIC VARIABLES MEASUREMENT; NETWORKS (CIRCUITS); POWER AMPLIFIERS; POWER ELECTRONICS; TEMPERATURE DISTRIBUTION;

FINITE ELEMENT METHOD;

EID: 27644506526     PISSN: 10964290     EISSN: None     Source Type: Journal    
DOI: 10.1002/mmce.20105     Document Type: Article

References (23)

1. H. Blanck, Industrial gainp/gaas power hbt mmic process, GAAS, Paris, 2000, p. 113.
2. B. Bayraktaroglu, Hbt power devices and circuits, Solid-State Electron 41 (1997), 1657-1665.
3. S. Delage, D. Floriot, H. Blanck, M. Di Forte Poisson, C. Brylinski, Y. Perreal, and D. Pons, Power gainp/gaas hbt mmic's, EuMC Cannes, France, 1994, pp. 1141-1148.
4. D. Hill and T. Kim, 28-v low thermal impedance hbt with 20-w cw output power, IEEE MTT-S Int Microwave Symp Dig 1 (1997), 137-140.
5. D. Floriot, S. Delage, S. Piotrowicz, E. Chartier, and P. Auxemery, High-power hbt technology: Present and trends, GAAS London, 2001, p. 57.
6. B. Moore, Principal component analysis in linear systems: Controllability, observability, and model reduction, IEEE Trans Automatic Control 26 (1981), 17-32.
7. A. Rachid and G. Hashim, Model reduction via schur decomposition, IEEE Trans Automatic Control 37 (1992), 666-668.
8. M.G. Safonov and R.Y. Chiang, A schur method for balanced-truncation model reduction, IEEE Trans Automatic Control 34 (1989), 729-733.
9. C. De Villemagne and R.E. Skelton, Model reduction using a projection formulation, Int J Contr 46 (1987), 2141-2169.
10. J.T. Hsu and L. Vu-Quoc, A rational formulation of thermal circuit models for electrothermal simulation I: Finite-element method, IEEE Trans Cire Syst Applic 43 (1996), 721-732.
11. J.T. Hsu and L. Vu-Quoc, A rational formulation of thermal circuit models for electrothermal simulation II: Model reduction techniques, IEEE Trans Cire Syst Theory Applic 43 (1996), 733-744.
12. E.L. Wilson and M.W. Yuan, Dynamic analysis by direct superposition of Ritz vectors, Earthquake Eng Structural Dynam 10 (1982), 813-821.
13. INRIA, MODULEF manual, May 1997.
14. ANSYS, ANSYS manual, Release 6.1, April 2002.
15. E. Gad, R. Khazaka, M. Nakhla, and R. Griffith, Circuit reduction technique for finding the steady state solution of nonlinear circuits, IEEE MTT-S Int Microwave Symp Dig 1 (2000), 83-86.
16. W.B. Joyce, Thermal resistance of heat sinks with temperature-dependent conductivity, Solid-State Electron 18 (1975), 321-322.
17. W. Batty and C.M. Snowden, Electro-thermal device and circuit simulation with thermal nonlinearity due to temperature dependent diffusivity, Electron Lett 36 (2000), 1966-1968.
18. R. Sommet, D. Lopez, and R. Quere, Electrothermal harmonic balance simulation of an ingap/gaas hbt based on 3D thermal and semiconductor transport models, GAAS, Paris, 2000, pp. 516-519.
19. th Intersoc Conf Thermal and Thermomechan Phenomena Electron Syst (ITHERM 2002), San Diego, 2002, pp. 22-28.
20. T. Peyretaillade, M. Perez, S. Mons, R. Sommet, P. Auxemery, J.C. Lalaurie, and R. Quere, A pulsed measurement-based electrothermal model of hbt with thermal stability prediction capabilities, IEEE MTT-S Int Microwave Symp Dig 3 (1997), 1515-1518.
21. W. Liu and A. Khatibzadeh, The collapse of current gain in multi-finger heterojunction bipolar transistors: its substrate temperature dependence, instability criteria, and modeling, IEEE Trans Electron Devices 41 (1994), 1698-1707.
22. W. Liu, S. Nelson, D.G. Hill, and A. Khatibzadeh, Current gain collapse in microwave multifinger heterojunction bipolar transistors operated at very high power densities, IEEE Trans Electron Devices 40 (1993), 1917-1927.
23. K. Lu and C.M. Snowden, Analysis of thermal instability in multi-finger power algaas/gaas hbt's, IEEE Trans Electron Devices 43 (1996), 1799-1805.