Trends and challenges of environmentally friendly laminates

Printed Circuit Fabrication

Volumn 26, Issue 3, 2003, Pages

  Rajoo, Ranjan ^a   Wong, E H ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC PROPERTIES; ELECTRIC FREQUENCY MEASUREMENT; ELECTRIC IMPEDANCE MEASUREMENT; ENVIRONMENTAL IMPACT; HEAT RESISTANCE; LAMINATES; MOISTURE CONTROL; PRINTED CIRCUIT BOARDS; REGULATORY COMPLIANCE; STANDARDIZATION; THERMAL VARIABLES MEASUREMENT;

DIELECTRIC MEASUREMENT; HALOGEN-FREE LAMINATES; IMPEDANCE ANALYZER; MOISTURE RESISTANCE;

PRINTED CIRCUIT MANUFACTURE;

EID: 0037352764     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

1. National Electronics Manufacturing Initiative Web site (www.nemi.org).
2. Japan Electronics and Information Technology Industries Association (JEITA), Japan Jisso Technology Roadmap 1999, September 2000, pp. 228-229.
3. Mark Hutton, et al, "Halogen Free, Fact or Friction," EPIC, pp. S3-01 to S3-24, 2001.
4. JPCA-ES-01-1999, "Test Method for Halogen Free Materials."
5. DIN 53436 (Part 1-5), "Method for Testing the Inhalation Toxicity."
6. ISO/TR 9122 (Part 6), "Toxicity Testing of Fire Effluents."
7. IEC 61249-2-18, "Materials for Printed Boards and other Interconnecting Structures" (Part 2-18), Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad.
8. R. Rajoo and E. H. Wong, "Moisture Characteristic and Performance of Halogen Free Laminates," International Conference on Electronic Packaging (ICEP) Proceedings, pp. 480-485, April 2002.
9. UL 94, "Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances," October 1996.
10. JEITA, Japan Jisso Technology Roadmap 2001, April 2001.
11. Jedec JESD22-120A, "Test Method for Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits."
12. IPC-TM-650, method 2.6.16, "Pressure Vessel Method for Glass Epoxy Laminate Integrity," July 1985.
13. E. H. Wong, R. Rajoo, S.W. Koh, and T.B. Lim, "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packages," ASME Journal of Electronic Packaging, pp. 122-126, vol. 124, June 2002.
14. Nobuyuki Honda, "Environmental Friendly materials and lead-free," IPC Printed Circuits Expo Proceedings, April 2000.