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Volumn 2006, Issue , 2006, Pages 799-805

Parallel optical interconnect between ceramic BGA packages on FR4 board using embedded waveguides and passive optical alignments

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT; BIT ERROR RATE; MOUNTINGS; OPTICAL LINKS; OPTICAL WAVEGUIDES; PRINTED CIRCUIT BOARDS; SUBSTRATES;

EID: 33845568155     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645749     Document Type: Conference Paper
Times cited : (39)

References (11)
  • 1
    • 0001277815 scopus 로고    scopus 로고
    • Fully embedded board-level guided-wave optoelectronic interconnects
    • R. T. Chen et al., "Fully embedded board-level guided-wave optoelectronic interconnects", Proc. of the IEEE, Vol. 88, No. 6 (2000), pp.
    • (2000) Proc. of the IEEE , vol.88 , Issue.6
    • Chen, R.T.1
  • 2
    • 0034476474 scopus 로고    scopus 로고
    • New technology for electrical/optical systems on module and board level: The EOCB approach
    • D. Krabe, F. Ebeling, N. Arndt-Staunfenbiel, G. Lang, and W. Scheel, "New technology for electrical/optical systems on module and board level: The EOCB approach," in Proc. of ECTC, 2000, pp. 970-975.
    • (2000) Proc. of ECTC , pp. 970-975
    • Krabe, D.1    Ebeling, F.2    Arndt-Staunfenbiel, N.3    Lang, G.4    Scheel, W.5
  • 3
    • 12344251981 scopus 로고    scopus 로고
    • Embedded optical interconnects on printed wiring board
    • SPIE Photonics Europe, April
    • Karppinen, M. et al., "Embedded Optical Interconnects on Printed Wiring Board", SPIE Photonics Europe, April 2004, Proc. of SPIE, Vol. 5453, pp. 150-164.
    • (2004) Proc. of SPIE , vol.5453 , pp. 150-164
    • Karppinen, M.1
  • 5
    • 3543056371 scopus 로고    scopus 로고
    • Cost-effective packaging of laser modules using LTCC substrates
    • SPIE Photonics West, Jan, Photonics Packaging and Integration IV
    • Keränen, K. et al., "Cost-effective packaging of laser modules using LTCC substrates", SPIE Photonics West, Jan 2004, Photonics Packaging and Integration IV, Proc. of SPIE, Vol. 5358, pp. 111-121.
    • (2004) Proc. of SPIE , vol.5358 , pp. 111-121
    • Keränen, K.1
  • 6
    • 0742321726 scopus 로고    scopus 로고
    • Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers
    • Heyen, J. et al., "Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers", IEEE Trans. on Microwave Theory and Techniques, Vol. 51, No. 12 (2003), pp. 2589-2596.
    • (2003) IEEE Trans. on Microwave Theory and Techniques , vol.51 , Issue.12 , pp. 2589-2596
    • Heyen, J.1
  • 10
    • 27844454423 scopus 로고    scopus 로고
    • Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects
    • Immonen, M., Karppinen, M., Kivilahti, J., "Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects," IEEE Trans. on Electron. Pack. Manufact., Vol. 28, No. 4 (2005), pp. 304-311.
    • (2005) IEEE Trans. on Electron. Pack. Manufact. , vol.28 , Issue.4 , pp. 304-311
    • Immonen, M.1    Karppinen, M.2    Kivilahti, J.3
  • 11
    • 33846575238 scopus 로고    scopus 로고
    • Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards
    • in print
    • Immonen, M., Karppinen, M., Kivilahti, J.K., "Investigation of Environmental Reliability of Optical Polymer Waveguides Embedded on Printed Circuit Boards", Microelectronics Reliability (in print).
    • Microelectronics Reliability
    • Immonen, M.1    Karppinen, M.2    Kivilahti, J.K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.