Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 4, 2005, Pages 304-311

  Immonen, Marika ^a   Karppinen, Mikko ^b   Kivilahti, Jorma K ^c  

^a Perlos   (Finland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^c AALTO UNIVERSITY   (Finland)

Author keywords

Board level optics; Micromirrors; Optical printed circuit boards (o PCBs); Polymer optical waveguides; Three dimensional (3 D) interconnects

Indexed keywords

GLASS FIBER REINFORCED PLASTICS; IMAGING TECHNIQUES; INTEGRATED OPTICS; INTERFEROMETRY; LITHOGRAPHY; MIRRORS; OPTICAL INTERCONNECTS; OPTICAL MICROSCOPY; OPTICAL PROPERTIES; OPTICAL WAVEGUIDES; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE;

BOARD LEVEL OPTICS; MICROMIRRORS; OPTICAL PRINTED CIRCUIT BOARDS (O-PCBS); POLYMER OPTICAL WAVEGUIDES; THREE DIMENSIONAL (3D) INTERCONNECTS;

PRINTED CIRCUIT BOARDS;

EID: 27844454423     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.856538     Document Type: Article

References (25)

1. D. V. Plant and A. G. Kirk, "Optical interconnects at the chip and board level: challenges and solutions," Proc. IEEE, vol. 88, no. 6, pp. 806-818, Jun. 2000.
2. Y. Li, J. Ai, and J. Popelek, "Board-level 2-D data-capable optical interconnection circuits using polymer fiber-image guides," Proc. IEEE, vol. 88, no. 6, pp. 794-805, Jun. 2000.
3. G. Kim and R. T. Chen, "Three-dimensionally interconnected bidirectional optical backplane," IEEE Photon. Technol. Lett., vol. 11, no. 7, pp. 880-882, Jul. 1999.
4. Y. S. Lin, R. J. Wojnarowski, W. A. Hennessy, J. P. Bristow, L. Yue, A. Peczalski, J. Rowlette, A. Plotts, J. Stack, J. Yardley, L. Eldada, R. M. Osgood, R. Scarmozzino, S. H. Lee, and V. Ozgus, "Polymer Optical Interconnect Technology (POINT) optoelectronic packaging and interconnect for board and backplane applications," in Proc. SPIE Conf. Optoelectronic Interconnects and Packaging, vol. CR62, 1996, pp. 405-414.
5. L. Eldata, "Laser fabricated low-loss single-mode raised rib waveguide devices in polymers," IEEE J. Lightw. Technol., vol. 14, no. 7, pp. 1704-1713, Jul. 1996.
6. G. L. Bona, B. J. Offrein, U. Bapst, C. Berger, R. Beyeler, R. Budd, R. Dangel, L. Dellmann, and F. Horst, "Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board," in Proc. SPIE Photonics Eur. Conf., Strasbourg, France, 2004, pp. 134-141.
7. E. N. Glytis, N. M. Jokerest, R. Villalaz, S.-Y. Cho, S.-D. Wu, Z. Huang, M. A. Brooke, and T. K. Gaylord, "Substrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: analysis, design, and performance," IEEE J. Lightw. Technol., vol. 21, no. 10, pp. 2382-2394, Oct. 2003.
8. B. Luniz, J. Guttmann, H.-P. Huber, J. Moisel, and M. Rode, "Experimental demonstration of 2.5 Gbit/s transmission with 1-m polymer optical backplane," Electron. Lett., vol. 37, no. 17, p. 1079, Aug. 2001.
9. L. Li, "Analysis of planar waveguide grating couplers with double surface corrugations of identical period," Opt. Commun., vol. 114, pp. 406-412, 1995.
10. J. T. Kim, B. C. Kim, M. Jeong, and M. Lee, "Fabrication of a micro-optical coupling structure by using laser ablation," J. Mater. Proc. Technol., vol. 146, pp. 163-166, 2004.
11. S. Garner, S.-S. Lee, V. Chuyanov, A. Chen, A. Yacoubian, W. Steier, and L. Dalton, "Three-dimensional integrated optics using polymers," IEEE J. Quantum Electron., vol. 35, no. 8, pp. 1146-1155, Aug. 1999.
12. J.-S. Kim and J.-J. Kim, "Fabrication of multimode polymeric waveguides and micromirrors using deep X-ray lithography," IEEE Photon. Technol. Lett., vol. 16, no. 3, pp. 798-800, Mar. 2004.
13. J.-S. Kim and J.-J. Kim, "Stacked polymeric multimode waveguide arrays for two-dimensional optical interconnects," IEEE J. Lightw. Technol., vol. 22, no. 3, pp. 840-844, Mar. 2004.
14. J.-H. Kim and R. T. Chen, "A collimation mirror in polymeric planar waveguide formed by reactive ion etching," IEEE Photon. Technol. Lett., vol. 15, no. 3, pp. 422-424, Mar. 2003.
15. S. Lehmacher and A. Neyer, "Integration of polymer optical waveguides into printed circuit boards," Electron. Lett., vol. 36, no. 12, pp. 1052-1053, Jun. 2000.
16. V. Kudryashov, X.-C. Yuan, W.-C. Cheong, and K. Radhakrishnan, "Grey scale structures formation in SU-8 with E-Beam and UV," Microelectron. Eng., vol. 67-68, pp. 306-311, 2003.
17. A. Bertsch, H. Lorenz, and P. Reuand, "3-D microfabrication by combining microstereolithography and thick resist UV lithography," in Proc. IEEE MEMS Sensors Actuators Conf., 1998, pp. 18-23.
18. C. Yoonsu, K. Kieun, and M. G. Allen, "Continuously-varying, three-dimensional SU-8 structures: fabrication of inclined magnetic actuators," in Proc. IEEE MEMS Conf., 2002, pp. 176-179.
19. M. Immonen, M. Karppinen, and J. Kivilahti, "Fabrication and characterization of optical polymer waveguides embedded on printed wiring boards," in Proc. IEEE Polymers and Adhesives in Microelectronics and Photonics Conf., Montreux, Switzerland, 2003, pp. 91-95.
20. E. Griese, "Modeling of highly multimode waveguides for time-domain simulation," IEEE J. Sel. Topics Quantum Electron., vol. 9, no. 2, pp. 433-442, Mar./Apr. 2003.
21. H. Ding and I. C. Ume, "Parametric study of warpage of PWB assemblies and PWB assembly warpage minimization by component layout optimization," in Proc. IEEE Electronic Components and Technology Conf., vol. 2, Las Vegas, NV, 2004, pp. 1855-1861.
22. M. Huang, "Stress effects on the performance of optical waveguides," Int. J. Solids Structures, vol. 40, pp. 1615-1632, 2003.
23. J. Wu, M. Immonen, and J. Kivilahti, "Investigation of thermo-mechanical behavior of optical polymer waveguides embedded in printed wiring boards," in Proc. IEEE Polymers and Adhesives in Microelectronics and Photonics Conf., Portland, OR, 2004, pp. 206-210.
24. Y.-J. Chuang, F.-G. Tseng, and W.-K. Lin, "Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap elimination," Microsyst. Technol., vol. 8, pp. 308-313, 2002.
25. M. Karppinen, J. Mäkinen, K. Kataja, A. Tanskanen, T. Alajoki, P. Karioja, M. Immonen, and J. Kivilahti, "Embedded optical interconnect on printed wiring board," in Proc. SPIE Photon. Eur. Conf., Strasbourg, France, 2004, pp. 150-164.