Passively aligned fiber-optic transmitter integrated into LTCC module

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 20-25

  Karppinen, M ^a   Kautio, K ^a   Heikkinen, M ^a   Hakkila J ^a   Karioja, P ^a  

^a UNIVERSITY OF OULU   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; FIBER OPTICS; FLIP CHIP DEVICES; INTERFACES (MATERIALS); MULTICHIP MODULES; OPTICAL INTERCONNECTS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR LASERS; TRANSMITTERS;

DETACHABLE ELECTRICAL INTERFACE; FIBER OPTIC TRANSMITTER; HOT EMBOSSING TECHNIQUES; LOW TEMPERATURE COFIRED CERAMICS; RECEIVER MODULES;

INTEGRATED OPTOELECTRONICS;

EID: 0034828419     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Comparison of active and passive fiber alignment techniques for multimode laser pigtailing
2. Passive alignment of flip-chip bonded VCSEL-arrays using through-etced silicon carriers
3. The PONI-1 parallel-optical link
4. Low temperature co-fired tape dielectric material system for multilayer interconnections