New technology for electrical/optical systems on module and board level: the EOCB approach

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 970-974

  Krabe, Detlef ^a   Ebling, Frank ^a   Arndt Staufenbiel, Norbert ^a   Lang, Guenter ^a   Scheel, Wolfgang ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LOCAL AREA NETWORKS; OPTICAL FIBERS; OPTICAL INTERCONNECTS; OPTICAL LINKS; PRINTED CIRCUIT BOARDS;

BALL GRID ARRAY; ELECTRICAL OPTICAL CIRCUIT BOARD;

ELECTROOPTICAL DEVICES;

EID: 0034476474     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)