Influence of mold depth on capillary bridges in nanoimprint lithography

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 24, Issue 6, 2006, Pages 3011-3015

  Chaix, N ^a   Landis, S ^a   Hermelin, D ^a   Leveder, T ^a   Perret, C ^a   Delaye, V ^a   Gourgon, C ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL DEFECTS; FILM GROWTH; PLASTIC FILMS; PROCESS CONTROL; THERMAL EFFECTS;

FILLING STAMP CAVITIES; INDUSTRIAL PROCESSES; NANOIMPRINT LITHOGRAPHY (NIL);

NANOTECHNOLOGY;

EID: 33845256678     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2393249     Document Type: Article

References (15)

1. S. Y. Chou, Appl. Phys. Lett. 67, 3114 (1995).
2. H. Schift, L. J. Heyderman, M. Auf der Maur, and J. Gobrecht, Nanotechnology 12, 173 (2001).
3. H.-C. Scheer and H. Schulz, Microelectron. Eng. 56, 311 (2001).
4. F. Lazzarino, C. Gourgon, P. Schiavone, and C. Perret, J. Vac. Sci. Technol. B 22, 3318 (2004).
5. S. Landis, N. Chaix, C. Gourgon, C. Perret, and T. Leveder, Nanotechnology 17, 2701 (2006).
6. S. Y. Chou and L. Zhuang, J. Vac. Sci. Technol. B 17, 3197 (1999).
7. N. Chaix, C. Gourgon, S. Landis, C. Perret, M. Fink, F. Reuther, and D. Mecerreyes, Nanotechnology (submitted).
8. C. Perret, Microelectron. Eng. 73-74, 172 (2004).
9. C. Gourgon, C. Perret, and G. Micouin, Microelectron. Eng. 61-62, 385 (2002).
10. http://www.daikin.co.jp/chm/en/pro/kasei/dsx.html
11. www.scilab.org
12. C. Riddell, P. Brigger, R. E. Carson, and S. L. Bacharach, IEEE Trans. Nucl. Sci. 46, 713 (1999); H. Talbot and B. C. Appleton, Proceedings of ISMM (CSIRO Publishing, 2002), p. 229.
13. C. Riddell, P. Brigger, R. E. Carson, and S. L. Bacharach, IEEE Trans. Nucl. Sci. 46, 713 (1999); H. Talbot and B. C. Appleton, Proceedings of ISMM (CSIRO Publishing, 2002), p. 229.
14. K. Y. Suh and H. H. Lee, J. Chem. Phys. 115, 8204 (2001).
15. D. Andrienko, P. Patricio, and O. I. Vinogradova, J. Chem. Phys. 121, 4414 (2004).