Analysis of the residual stresses, the biaxial modulus, and the interfacial fracture energy of low- k dielectric thin films

Journal of Applied Physics

Volumn 100, Issue 10, 2006, Pages

  Atrash, Fouad ^a   Sherman, Dov ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; INTERFACIAL ENERGY; RESIDUAL STRESSES; SILICON WAFERS;

BIAXIAL MODULUS; SUPERLAYERS;

DIELECTRIC FILMS;

EID: 33845218690     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2386939     Document Type: Article

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