Studies on incorporation of additives in electrodeposited copper;Untersuchungen zum Einbau von Additiven in elektrochemisch abgeschiedenen Kupferschichten

Galvanotechnik

Volumn 96, Issue 5, 2005, Pages 1084-1087

  Stang, Marcel ^a   Acker, Jörg ^a   Henßge, Antje ^a   Gruner, Wolfgang ^a   Hoffmann, Volker ^a   Wendrock, Horst ^a   Wetzig, Klaus ^a  

^a IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGE-SOFTENING; DEPOSITION CURRENT DENSITY; ELECTRODEPOSITED COPPER; SELF-ANNEALING;

ADDITIVES; ANNEALING; COPPER; CURRENT DENSITY; ELECTROLYTES; MICROELECTRONICS; MICROSTRUCTURE; MOLECULAR WEIGHT;

ELECTRODEPOSITION;

EID: 18844388672     PISSN: 00164232     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

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5. S. Strehle; persönliche Mitteilung, IFW Dresden (2004)