Thermal and electromigration-induced strains in polycrystalline films and conductor lines: X-ray microbeam measurements and analysis

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 303-309

  Cargill III, G S ^a   Moyer, L E ^a   Wang, G ^a   Zhang, H ^a   Hu, C K ^b   Yang, W ^c   Larson, B C ^c   Ice, G E ^c  

^a Lehigh University   (United States)

^b IBM RESEARCH   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Electromigration; Microdiffraction; Strain

Indexed keywords

EID: 33751317060     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173563     Document Type: Conference Paper

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