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Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D861-D866

Strain measurements from single grains in passivated aluminum conductor lines by x-ray microdiffraction during electromigration

(3) Hwang, K J a Cargill, G S a Marieb, T b

a LEHIGH UNIVERSITY (United States)

b INTEL CORPORATION (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CURRENT DENSITY; ELECTROMIGRATION; PASSIVATION; STRAIN; VLSI CIRCUITS; X RAY DIFFRACTION ANALYSIS;

SINGLE GRAINS;

THIN FILMS;

EID: 0034429761 PISSN: 02729172 EISSN: None Source Type: Journal
DOI: 10.1557/proc-612-d8.6.1 Document Type: Article

Times cited : (4)

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