Stress migration in sputter-deposited aluminum interconnections for liquid crystal displays

R and D: Research and Development Kobe Steel Engineering Reports

Volumn 54, Issue 1, 2004, Pages 52-57

  Onishi, Takashi ^a   Takagi, Katsutoshi ^a   Fujii, Hideo ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; RESIDUAL STRESSES; SPUTTERING; STRESS ANALYSIS; TENSILE STRENGTH;

ALUMINUM INTERCONNECTIONS; STRESS MIGRATION; VOID FORMATION;

LIQUID CRYSTAL DISPLAYS;

EID: 33751189141     PISSN: 03738868     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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