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Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 14, Issue 5, 1996, Pages 2728-2735

Influence of adding transition metal elements to an aluminum target on electrical resistivity and hillock resistance in sputter-deposited aluminum alloy thin films

(4) Onishi, Takashi a Iwamura, Eiji a Takagi, Katsutoshi a Yoshikawa, Kazuo a

a KOBE STEEL LTD (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING ELEMENTS; ALUMINUM ALLOYS; ANNEALING; COMPOSITION EFFECTS; ELECTRIC CONDUCTIVITY; GRAIN GROWTH; LATTICE CONSTANTS; METALLOGRAPHIC PHASES; MICROSTRUCTURE; SOLID SOLUTIONS; STRESS RELAXATION; THERMODYNAMIC STABILITY;

ALUMINUM COBALT ALLOYS; ALUMINUM IRON ALLOYS; ALUMINUM NICKEL ALLOYS; HILLOCK FORMATION; HILLOCK SUPPRESSION;

THIN FILMS;

EID: 0030246371 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.580194 Document Type: Article

Times cited : (64)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.