Theoretical study on polyimide-Cu(100)/Ni(100) adhesion

Chemistry of Materials

Volumn 18, Issue 22, 2006, Pages 5312-5316

  Zhang, Jia ^a,b   Sullivan, Michael B ^a   Zheng, Jian Wei ^a   Loh, Kian Ping ^b   Wu, Ping ^a  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADSORPTION; COPPER; NICKEL; NITROGEN COMPOUNDS; OXIDATION; PROBABILITY DENSITY FUNCTION;

ADSORPTION ENERGIES; BRIDGE SITE; METAL FILLERS;

ORGANIC POLYMERS;

EID: 33751056908     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm052865n     Document Type: Article

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