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Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

Volumn 19, Issue 4, 2001, Pages 1072-1077

Chemical interaction and adhesion characteristics at the interface of metals (Cu, Ta) and low-k cyclohexane-based plasma polymer (CHexPP) films

(5) Kim, K J a Kim, K S a Lee, N E a Choi, J a Jung, D a

a Sungkyunkwan University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; CHEMICAL BONDS; DIELECTRIC FILMS; INTERFACES (MATERIALS); PERMITTIVITY; PLASMA APPLICATIONS; SURFACE REACTIONS; THERMODYNAMIC STABILITY; X RAY PHOTOELECTRON SPECTROSCOPY;

PLASMA POLYMER FILMS;

PLASTIC FILMS;

EID: 0035393108 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.1340658 Document Type: Article

Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.