The effect of embedding conditions on the thermal conductivity of β-Si3n4

Journal of the Ceramic Society of Japan

Volumn 114, Issue 1335, 2006, Pages 1093-1096

  Zhu, Xinwen ^a   Sakka, Yoshio ^a   Zhou, You ^b   Hirao, Kiyoshi ^b  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Microstructure; Powder bed; Silicon nitride; Sintering; Thermal conductivity; Weigh loss

Indexed keywords

CERAMIC MATERIALS; CRUCIBLES; DENSIFICATION; MICROSTRUCTURE; REACTION KINETICS; SILICON NITRIDE; SINTERING; THERMAL CONDUCTIVITY;

EMBEDDING CONDITIONS; POWDER BEDS; RAW POWDER; WEIGH LOSS;

SILICON COMPOUNDS;

EID: 33750700822     PISSN: 09145400     EISSN: 13486535     Source Type: Journal    
DOI: 10.2109/jcersj.114.1093     Document Type: Article

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