Effect of grain size on the thermal conductivity of Si3N4

Journal of the American Ceramic Society

Volumn 82, Issue 3, 1999, Pages 777-779

  Watari, Koji ^a   Hirao, Kiyoshi ^a   Toriyama, Motohiro ^a   Ishizaki, Kozo ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTATIONAL METHODS; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HOT ISOSTATIC PRESSING; PHONONS; POINT DEFECTS; POLYCRYSTALLINE MATERIALS; SINTERING; THERMAL CONDUCTIVITY OF SOLIDS;

PHONON MEAN FREE PATH;

SILICON NITRIDE;

EID: 0032662579     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1999.tb01835.x     Document Type: Article

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