Effect of post-sintering heat-treatment on thermal conductivity of Si 3N4 ceramics containing different additives

Journal of the Ceramic Society of Japan

Volumn 113, Issue 1318, 2005, Pages 394-399

  Wasanapiarnpong, Thanakorn ^a   Wada, Shigetaka ^b   Imai, Masamitsu ^a   Yano, Toyohiko ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b CHULALONGKORN UNIVERSITY   (Thailand)

Author keywords

Additive; Heat treatment; Oxygen content; Silicon nitride; Thermal conductivity

Indexed keywords

ADDITIVES; ANISOTROPY; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; POWDERS; SILICON NITRIDE; SINTERING; THERMAL CONDUCTIVITY;

ELECTRONIC SUBSTRATES; GAS PRESSURE; OXYGEN CONTENT; WHISKERS;

CERAMIC MATERIALS;

EID: 22444439149     PISSN: 09145400     EISSN: None     Source Type: Journal    
DOI: 10.2109/jcersj.113.394     Document Type: Article

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