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2 interface of 0.43 GPa after 120 min of oxidation. Using an elastic modulus of 161 GPa (the mean of the 〈111〉, 〈110〉, and 〈100〉 values reported in ref 28), the corresponding strain is found to be 0.27%. Using the thermal expansion values given in the text, the thermal strain is calculated to be of magnitude 0.2%; this component should be tensile since the Si core decreases in size more than does the oxide sheath as the system cools. Therefore, the thermal strain should reduce the compressive strain created during oxidation. If the two components are of comparable magnitude, the net strain in the wire is small.
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