Microstructure characterization of metal interconnects and barrier layers: Status and future

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 233-235

  Zschech, E ^a   Besser, P R ^b  

^a IBM MICROELECTRONICS   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; FILMS; MICROSTRUCTURE;

ADVANCED MATERIALS; BARRIER LAYERS; FEATURE SIZES; FLAT SUBSTRATES; INTERCONNECT LINES; METAL INTERCONNECTS; MICROSTRUCTURE CHARACTERIZATION; ON CHIP INTERCONNECT;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84962844795     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854334     Document Type: Conference Paper

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