Process-oriented stress modeling and stress evolution during Cu/low-K BEoL processing

Materials Research Society Symposium Proceedings

Volumn 812, Issue , 2004, Pages 275-280

  Zhai, Charlie Jun ^a   Besser, Paul R ^a   Feustel, Frank ^a   Marathe, Amit ^a   Blish II, Richard C ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; COPPER; DEPOSITION; DIELECTRIC MATERIALS; ELASTICITY; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; METALLIC FILMS; MICROSTRUCTURE; STRESS ANALYSIS; STRESSES; X RAY DIFFRACTION ANALYSIS;

BACK END OF LINE (BEOL) PROCESSING; FILM DEPOSITION; FINITE ELEMENT MODELING (FEM); INTRINSIC STRESSES;

INTERCONNECTION NETWORKS;

EID: 12844287518     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-812-f1.8     Document Type: Conference Paper

References (8)

1. A.O. Cifuentes and I.A. Shareef, IEEE Trans. Semiconductor Manufacturing v15, 128 (1992).
2. J. Lee and A. Sauter Mack, IEEE Trans. Semiconductor Manufacturing v11, 458 (1998).
3. D. Gan, G. Wang and P.S. Ho, Proceedings of the International Interconnect Technology Conference, 271 (2002).
4. S-H. Rhee, Y. Du and P.S. Ho, Proceedings of the International Interconnect Technology Conference, 89 (2001).
5. G. Reimbold, et al., Proceedings of IEEE IEDM 2002, 745 (2002).
6. P.R. Besser et al., Journal of Electronic Materials 30 (4), 320 (2001).
7. P.R. Besser and Q.T. Jiang, Accepted for publication in MRS Symp. Proc. 795 (2004).
8. G. Stoney, The Tension of Metallic Films Deposited by Electrolysis, Proc. Roy. Soc., London, A 82, 1909