The dielectric material dependence of stress and stress relaxation on the mechanism of stress-voiding of CU interconnects

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2005, Pages 195-202

  Paik, Jong Min ^a   Jung, Jung Kyu ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CU-INTERCONNECTS; HYDROSTATIC STRESS; STRESS MODELS; THERMOMECHANICAL STRESS;

COMPUTER SIMULATION; COPPER; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; STRESS RELAXATION; THERMAL STRESS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 28744434915     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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