Challenges of ultra low-k dielectric measurement and plasma damage assessment

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 273-279

  Abell, Thomas ^a   Lee, Jeffrey ^b   Moinpour, Mansour ^a  

^a INTEL CORPORATION   (United States)

^b Intel Corporation Belgium   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING; INTEGRATED CIRCUITS; MECHANICAL PROPERTIES; NONDESTRUCTIVE EXAMINATION; PLASMA APPLICATIONS; RADIATION; SILICA;

INTERCONNECT WIRING; LOW-K DIELECTRIC FILMS; PLASMA PROCESSING DAMAGE; POST-DEPOSITION PROCESSING;

DIELECTRIC MATERIALS;

EID: 33749619175     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f04-02     Document Type: Conference Paper

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