Dynamic Lateral Force Measurements during Chemical Mechanical Polishing of Silica

Electrochemical and Solid-State Letters

Volumn 2, Issue 2, 1999, Pages 80-82

  Mahajan, U ^a   Bielmann, M ^a   Singh, R K ^a  

^a University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; FORCE MEASUREMENT; FRICTION; IONIC STRENGTH; PH; SLURRIES; SURFACE ROUGHNESS;

CHEMICAL MECHANICAL POLISHING; FRICTIONAL FORCE MEASUREMENT;

SILICA;

EID: 0033075203     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390741     Document Type: Article

References (7)

1. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, Inc., New York (1997).
2. R. Jairath, J. Farkas, C. K. Huang, M. Stell, and S-M. Tzeng, Solid State Technol., 37, 71 (1994)
3. U. Mahajan, M. Bielmann, and R. K. Singh, Electrochem. Solid-State Lett., 2, 46 (1999).
4. J. N. Israelachvili, Intermolecular and Surface Forces, 2nd ed, Academic Press, New York (1992).
5. L. M. Cook, J. Non-Cryst. Solids, 120, 152 (1990).
6. R. K. Iler, The Chemistry of Silica, John Wiley & Sons, Inc., New York (1979).
7. M. Nogami and M. Tomozawa, J. Am. Ceram. Soc., 67, 151 (1984).