Creep flow, diffusion, and electromigration in small scale interconnects

Journal of the Mechanics and Physics of Solids

Volumn 54, Issue 12, 2006, Pages 2554-2568

  Kim, Dongchoul ^a   Lu, Wei ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Creep; Electromigration; Nanostructure; Phase field model

Indexed keywords

CONCURRENT KINETICS; CREEP FLOW; PHASE FIELD MODELS; SMALL SCALE INTERCONNECTS;

COMPUTATIONAL GEOMETRY; COMPUTER SIMULATION; CREEP TESTING; DIFFUSION; NANOSTRUCTURED MATERIALS; VISCOSITY;

ELECTROMIGRATION;

EID: 33749607796     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmps.2006.06.001     Document Type: Article

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