Electromigration failure distributions of dual damascene Cu /low - k interconnects

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1581-1586

  Oates, A S ^a   Lee, S C ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMIGRATION; ELECTRON DEVICES; ELECTRONICS INDUSTRY; FAILURE ANALYSIS; RELIABILITY;

DAMASCENE; FAILURE DISTRIBUTION; INCUBATION; VOID MORPHOLOGY;

INTERCONNECTION NETWORKS;

EID: 33747783913     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.038     Document Type: Article

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