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Volumn 50, Issue 7-8, 2006, Pages 1425-1429

Structural properties of alloyed Ti/Al/Ti/Au and Ti/Al/Mo/Au ohmic contacts to AlGaN/GaN

Author keywords

AlGaN; Defects; GaN; HEMT; Ohmic contacts; Reliability

Indexed keywords

ALUMINUM ALLOYS; ANNEALING; ETCHING; GALLIUM NITRIDE; HIGH ELECTRON MOBILITY TRANSISTORS; SAPPHIRE; TITANIUM ALLOYS;

EID: 33747198325     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2006.07.003     Document Type: Article
Times cited : (36)

References (10)
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    • Gillespie J., Crespo A., Fitch R., Jessen G., and Via G. AlGaN/GaN ohmic contact resistance variations across epitaxial suppliers. Solid State Electron 49 (2005) 670-672
    • (2005) Solid State Electron , vol.49 , pp. 670-672
    • Gillespie, J.1    Crespo, A.2    Fitch, R.3    Jessen, G.4    Via, G.5
  • 5
    • 25144439898 scopus 로고    scopus 로고
    • Comprehensive study of Ohmic electrical characteristics and optimization of TiAlMoAu multilayer ohmics on undoped AlGaNGaN heterostructure
    • Sun Y., Chen X., and Eastman L. Comprehensive study of Ohmic electrical characteristics and optimization of TiAlMoAu multilayer ohmics on undoped AlGaNGaN heterostructure. J Appl Phys 98 (2005) 053701
    • (2005) J Appl Phys , vol.98 , pp. 053701
    • Sun, Y.1    Chen, X.2    Eastman, L.3
  • 6
    • 28344438079 scopus 로고    scopus 로고
    • Dislocation-induced nonuniform interfacial reactions of Ti/Al/Mo/Au ohmic contacts on AlGaN/GaN heterostructure
    • Wang L., Mohammed F., and Adesida I. Dislocation-induced nonuniform interfacial reactions of Ti/Al/Mo/Au ohmic contacts on AlGaN/GaN heterostructure. Appl Phys Lett 87 (2005) 141915
    • (2005) Appl Phys Lett , vol.87 , pp. 141915
    • Wang, L.1    Mohammed, F.2    Adesida, I.3
  • 7
    • 29044440928 scopus 로고    scopus 로고
    • Ohmic contact formation mechanism of Ta/Al/Mo/Au and Ti/Al/Mo/Au metallizations on Al/GaN/GaN HEMTs
    • Wang L., Mohammed F., Adesida I., Selvanathan D., and Hu H. Ohmic contact formation mechanism of Ta/Al/Mo/Au and Ti/Al/Mo/Au metallizations on Al/GaN/GaN HEMTs. J Vac Sci Technol B 23-6 (2005) 2330-2335
    • (2005) J Vac Sci Technol B , vol.23-6 , pp. 2330-2335
    • Wang, L.1    Mohammed, F.2    Adesida, I.3    Selvanathan, D.4    Hu, H.5
  • 9
    • 0036639522 scopus 로고    scopus 로고
    • Structural and electrical characterization of AuTiAlTi/AlGaN/GaN ohmic contacts
    • Fay M., Moldovan G., Brown P., Harrison I., Birbeck J., Hughes B., et al. Structural and electrical characterization of AuTiAlTi/AlGaN/GaN ohmic contacts. J Appl Phys 92 (2002) 94-97
    • (2002) J Appl Phys , vol.92 , pp. 94-97
    • Fay, M.1    Moldovan, G.2    Brown, P.3    Harrison, I.4    Birbeck, J.5    Hughes, B.6
  • 10
    • 21444437088 scopus 로고    scopus 로고
    • Electrical activation characteristics of silicon-implanted GaN
    • Irokawa Y., Fujishima O., Kachi T., and Nakano Y. Electrical activation characteristics of silicon-implanted GaN. J Appl Phys 97 8 (2005) 83505-83510
    • (2005) J Appl Phys , vol.97 , Issue.8 , pp. 83505-83510
    • Irokawa, Y.1    Fujishima, O.2    Kachi, T.3    Nakano, Y.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.