Effect of post-sintering heat-treatment on thermal and mechanical properties of Si3N4 ceramics sintered with different additives

Journal of the European Ceramic Society

Volumn 26, Issue 15, 2006, Pages 3467-3475

  Wasanapiarnpong, Thanakorn ^a   Wada, Shigetaka ^b   Imai, Masamitsu ^a   Yano, Toyohiko ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b CHULALONGKORN UNIVERSITY   (Thailand)

Author keywords

Mechanical properties; Si3N4; Thermal conductivity

Indexed keywords

BENDING STRENGTH; CERAMIC MATERIALS; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; SINTERING; THERMAL CONDUCTIVITY; VAPORIZATION;

GLASSY PHASE; LATTICE OXYGEN; NITROGEN GAS PRESSURE; POST-SINTERING HEAT-TREATMENT;

SILICON NITRIDE;

BENDING STRENGTH; CERAMIC MATERIALS; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; SILICON NITRIDE; SINTERING; THERMAL CONDUCTIVITY; VAPORIZATION;

EID: 33747054524     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2005.10.011     Document Type: Article

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