Effect of grain growth and measurement on fracture toughness of silicon nitride ceramics

Journal of Materials Science

Volumn 34, Issue 22, 1999, Pages 5543-5548

  Yang, Jianfeng ^a,b   Sekino, Tohru ^a   Niihara, Koichi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CERAMIC MATERIALS; FRACTURE TOUGHNESS; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MAGNESIUM COMPOUNDS; POWDERS; SINTERING; TEMPERATURE; ZIRCONIA;

GRAIN BRIDGING; INDENTATION MICROFRACTURE; SINGLE EDGE PREPACKED BEAM METHODS;

SILICON NITRIDE;

EID: 0033357125     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004724814778     Document Type: Article

References (19)

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