SCOPUS 정보 검색 플랫폼

Volumn 17, Issue 8, 2006, Pages 577-586

Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading

Author keywords

[No Author keywords available]

Indexed keywords

CREEP TESTING; LOAD TESTING; MATHEMATICAL MODELS; STRESSES; TERNARY SYSTEMS; THERMAL EFFECTS;

LEAD-FREE SOLDER; STEP-LOADING; TERNARY ALLOY;

SOLDERING ALLOYS;

EID: 33746341504 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-006-0002-7 Document Type: Article

Times cited : (11)

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