Thermal resistance measurement protocols

Microelectronics Journal

Volumn 29, Issue 4-5, 1998, Pages 199-208

  O'Flaherty, M ^a   Cahill, C ^a   Rodgers, K ^a   Slattery, O ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CALIBRATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FINITE VOLUME METHOD; HEAT RESISTANCE; HEAT TRANSFER; MATHEMATICAL MODELS; TEMPERATURE MEASUREMENT;

ELECTRONIC DEVICE MINIATURIZATION; THERMAL RESISTANCE MEASUREMENT;

MICROELECTRONIC PROCESSING;

EID: 0032043427     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2692(97)00058-x     Document Type: Article

References (8)

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