Array sockets and connectors using MicroSpring™ technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2000, Pages 129-140

  Tracy, N L ^a   Rothenberger, R ^a   Copper, C ^a   Corman, N ^a   Biddle, G ^a   Matthews, A ^a   McCarthy, S ^a  

^a Tyco Electronics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; DURABILITY; ELECTRONICS INDUSTRY; INDUSTRIAL ECONOMICS; PERFORMANCE; PRINTED CIRCUIT BOARDS;

ARRAY SOCKETS; MICROSPRING TECHNOLOGY; PRODUCTION COSTS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034447119     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)