Microstructure of ceramic thick film formed by aerosol deposition and its applications to microactuator

Integrated Ferroelectrics

Volumn 80, Issue 1, 2006, Pages 55-65

  Akedo, Jun ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Aerosol deposition; Ceramics integration; MEMS; Optical scanner; PZT; Thick film

Indexed keywords

DEPOSITION; HEAT TREATMENT; MICROACTUATORS; MICROSTRUCTURE; SUBSTRATES; THICK FILM CIRCUITS;

AEROSOL DEPOSITION; MECHANICAL PUNCHING; MEMS; PIEZOELECTRIC THICK LAYER; POST HEAT TREATMENT; PZT; ROOM TEMPERATURE;

FERROELECTRIC CERAMICS;

EID: 33745759911     PISSN: 10584587     EISSN: 16078489     Source Type: Conference Proceeding    
DOI: 10.1080/10584580600656221     Document Type: Article

References (28)

1. J. Akedo and M. Lebedev, "Aerosol Deposition Method (AD): A Novel Method of PZT Thick Films Producing for Microactuators," Recent Res. Develp. Mat. Sci., 2 (Research Signpost, India) 51-77 (2001).
2. J. Akedo and M. Lebedev, Jpn. J. Appl. Phys. 38, 5397 (1999).
3. J. Akedo, M. Ichiki, K. Kikuchi, and R. Maeda, Sens. & Actuat. A 69, 106 (1998)
4. (Presented in IEEE 10th Inter. Work. Micro Electro Mechanical Systems 97 Nagoya, (1997);
5. Proc. Micro MAT'97, Berlin, Germany, 614 16-18 (1997).
6. J. Akedo, N. Minami, K. Fukuda, M. Ichiki, and R. Maeda, Ferroelectrics 231, 285 (1999).
7. J. Akedo and M. Kiyohara, J. Soc. Powder Tech., Jpn. 40, 192 (2003).
8. J. Akedo and M. Lebedev, Jpn. J. Appl. Phys. 40, 5528 (2001).
9. J. Akedo, M. Lebedev, A. Iwata, H. Ogiso, and S. Nakano, Mat. Res. Soc. Symp. Proc. (U8.10/W7.10), 778, 289 (2003).
10. J. Akedo and M. Lebedev, Jpn. J. Appl. Phys. 41, 6980 (2002).
11. M. Levedev, J. Akedo, K. Mori, and T. Eiju, J. Vac. Sci. & Tech. A 18(2), 563 (2000).
12. J. Akedo and M. Lebedev, Appl. Phys. Lett. 77, 1710 (2000).
13. J. Akedo and M. Lebedev, J. Cryst. Growth 235, 397 (2002).
14. M. Nakada, K. Ohashi, and J. Akedo, Jpn. J. Appl. Phys. 43, 6543 (2004).
15. O. R. Bergmann and J. Barrington, J. Am. Ceram. Soc. 49, 502 (1966).
16. H. Hirai and K. Kondo, J. Am. Ceram. Soc. 77(2), 487 (1994).
17. Ph. Luginbuhl, G.-A. Racine, Ph. Lerch, B. Romanowicz, K.G. Brooks, N.F. de Rooij, Ph. Renaud, and N. Setter, Sens. & Actual. A 54, 530 (1996).
18. I. Kanno, S. Fujii, T. Kamada, and R. Takayama, Appl. Phys. Lett. 70, 1378 (1997).
19. Y. Sakashita, T. Ono, H. Segawa, K. Tominaga, and M. Okada, J. Appl. Phys. 69, 8352 (1991).
20. H. Kidoh, T. Ogawa, A. Morimoto, and T. Shimizu, Appl. Phys. Lett. 58(25), 2910 (1991).
21. Y. Ohba, M. Miyauchi, T. Tsurumi, and M. Daimon, Jpn. J. Appl. Phys. 32, 4095 (1993).
22. J. R. Cheng, W. Zhu, N. Li, and L. E. Cross, Appl. Phys. Lett. 81, 4805 (2002).
23. Zou, Q., H. E. Ruda, and B. G. Yacobi, Appl. Phys. Lett. 78, 1282 (2001).
24. M. Bayer, Head and Helmet-Mounted Displays VII, Proceedings of SPIE Vol. 4711, Orlando, Florida (2002).
25. H. Urey, Proceedings of SPIE Vol. 4773, Seattle, Washington, 27 (2002).
26. M. Ikeda, H. Totani, A. Akiba, H. Goto, M. Matsumoto, and T. Yada, Proc. Annual Int. Conf. IEEE MEMS'99 435 (1999).
27. Y. Yamada, T. Kuriyama, Proc. IEEE Annual Int. Conf. MEMS'98, Heidelberg, Germany, 110 (1998).
28. N. Asai, et al., Proc. IEEE Annual Int. Conf. MEMS'2003, Kyoto, Japan, 247 (2003).