A novel tool for cure dependent viscoelastic characterization of packaging polymers

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 385-390

  Van 'T Hof, C ^a   Wisse, G ^a   Ernst, L J ^a   Jansen, K M B ^a   Yang, D G ^a   Zhang, G Q ^b   Bressers, H J L ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

Curing; DMA; Packaging polymers; Residual stress; Viscoelasticity

Indexed keywords

ADHESION; CURING; DEFORMATION; DEGREES OF FREEDOM (MECHANICS); DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; FINITE ELEMENT METHOD; INORGANIC POLYMERS; RESIDUAL STRESSES; SHRINKAGE; STRAIN RATE;

ELASTIC STEEL; EXCITATION FREQUENCY; PACKAGING POLYMERS; STRAIN FIELDS;

VISCOELASTICITY;

EID: 3843090524     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. L.J. Ernst et al., Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers, In: Proc. of the 10th Int. Conf. on Mechanics and Technology of Composite Materials, Sofia, Bulgaria, Sept. 2003, pp. 38-44;
2. Jansen, K.M.B. et al., Cure-Temperature and Time Dependent Constitutive Modeling of Moulding Compounds, to be published in: Proc. of the 5th Int. Conf. on Thermal & Mechanical Simulations and Experiments in Micro-Electronics and Micro-Systems, EuroSIME2004, Brussels;
3. Jansen, K.M.B. et al., Constitutive Modeling of Moulding Compounds, to be published in: Proc. of the 54th Electronic Components and Technology Conference, ECTC2004, Las Vegas;
4. Ferry, J.D., Viscoelastic Properties of Polymers, Wiley & Sons, 1980;
5. nd edition, Wiley & Sons, 1983.