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Volumn , Issue , 2004, Pages 385-390

A novel tool for cure dependent viscoelastic characterization of packaging polymers

Author keywords

Curing; DMA; Packaging polymers; Residual stress; Viscoelasticity

Indexed keywords

ADHESION; CURING; DEFORMATION; DEGREES OF FREEDOM (MECHANICS); DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; FINITE ELEMENT METHOD; INORGANIC POLYMERS; RESIDUAL STRESSES; SHRINKAGE; STRAIN RATE;

EID: 3843090524     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (6)

References (5)
  • 1
    • 3843116791 scopus 로고    scopus 로고
    • Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers
    • Sofia, Bulgaria, Sept.
    • L.J. Ernst et al., Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers, In: Proc. of the 10th Int. Conf. on Mechanics and Technology of Composite Materials, Sofia, Bulgaria, Sept. 2003, pp. 38-44;
    • (2003) Proc. of the 10th Int. Conf. on Mechanics and Technology of Composite Materials , pp. 38-44
    • Ernst, L.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.