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Volumn , Issue , 2004, Pages 385-390
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A novel tool for cure dependent viscoelastic characterization of packaging polymers
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Author keywords
Curing; DMA; Packaging polymers; Residual stress; Viscoelasticity
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Indexed keywords
ADHESION;
CURING;
DEFORMATION;
DEGREES OF FREEDOM (MECHANICS);
DYNAMIC MECHANICAL ANALYSIS;
ELASTIC MODULI;
FINITE ELEMENT METHOD;
INORGANIC POLYMERS;
RESIDUAL STRESSES;
SHRINKAGE;
STRAIN RATE;
ELASTIC STEEL;
EXCITATION FREQUENCY;
PACKAGING POLYMERS;
STRAIN FIELDS;
VISCOELASTICITY;
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EID: 3843090524
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (6)
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References (5)
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