-
1
-
-
33745624126
-
Implementation of an imprint damascene process for interconnect fabrication
-
Schmid, G.M., M. Stewart, J.T. Wetzel, F.L. Palmieri, J. Hao, Y. Nishimura, K. Jen, E.K. Kim, D.J. Resnick, J.A. Liddle, and C.G. Willson, "Implementation of an Imprint Damascene Process for Interconnect Fabrication". Journal of Vacuum Science & Technology, B, 2005.
-
(2005)
Journal of Vacuum Science & Technology, B
-
-
Schmid, G.M.1
Stewart, M.2
Wetzel, J.T.3
Palmieri, F.L.4
Hao, J.5
Nishimura, Y.6
Jen, K.7
Kim, E.K.8
Resnick, D.J.9
Liddle, J.A.10
Willson, C.G.11
-
2
-
-
24644465507
-
Direct imprinting of dielectric materials for dual damascene processing
-
(Pt. 1, Emerging Lithographic Technologies IX)
-
Stewart, M.D., J.T. Wetzel, G.M. Schmid, F. Palmieri, E. Thompson, E.K. Kim, D. Wang, K. Sotodeh, K. Jen, S.C. Johnson, J. Hao, M.D. Dickey, Y. Nishimura, R.M. Laine, D.J. Resnick, and C.G. Willson, "Direct imprinting of dielectric materials for dual damascene processing". Proceedings of SPIE-The International Society for Optical Engineering, 2005. 5751(Pt. 1, Emerging Lithographic Technologies IX): p. 210-218.
-
(2005)
Proceedings of SPIE-The International Society for Optical Engineering
, vol.5751
, pp. 210-218
-
-
Stewart, M.D.1
Wetzel, J.T.2
Schmid, G.M.3
Palmieri, F.4
Thompson, E.5
Kim, E.K.6
Wang, D.7
Sotodeh, K.8
Jen, K.9
Johnson, S.C.10
Hao, J.11
Dickey, M.D.12
Nishimura, Y.13
Laine, R.M.14
Resnick, D.J.15
Willson, C.G.16
-
3
-
-
0033677323
-
Low dielectric constant materials for ULSI interconnects
-
Morgen, M., E.T. Ryan, J.-H. Zhao, C. Hu, T. Cho, and P.S. Ho, "Low dielectric constant materials for ULSI interconnects". Annual Review of Materials Science, 2000. 30: p. 645-680.
-
(2000)
Annual Review of Materials Science
, vol.30
, pp. 645-680
-
-
Morgen, M.1
Ryan, E.T.2
Zhao, J.-H.3
Hu, C.4
Cho, T.5
Ho, P.S.6
-
4
-
-
0348199133
-
Impact of low k dielectrics on electromigration reliability for Cu interconnects
-
(Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003)
-
Ho, P.S., K.-d. Lee, E.T. Ogawa, S. Yoon, and X. Lu, "Impact of low k dielectrics on electromigration reliability for Cu interconnects". Materials Research Society Symposium Proceedings, 2003. 766(Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003): p. 97-106.
-
(2003)
Materials Research Society Symposium Proceedings
, vol.766
, pp. 97-106
-
-
Ho, P.S.1
Lee, K.-D.2
Ogawa, E.T.3
Yoon, S.4
Lu, X.5
-
5
-
-
1142300333
-
Reliability challenges for copper interconnects
-
Li, B., T.D. Sullivan, T.C. Lee, and D. Badami, "Reliability challenges for copper interconnects". Microelectronics Reliability, 2004. 44(3): p. 365-380.
-
(2004)
Microelectronics Reliability
, vol.44
, Issue.3
, pp. 365-380
-
-
Li, B.1
Sullivan, T.D.2
Lee, T.C.3
Badami, D.4
-
6
-
-
33745596508
-
The electromigration short-length effect in AlCu and Cu interconnects
-
(Stress-Induced Phenomena in Metallization)
-
Filippi, R.G., P.C. Wang, R.A. Wachnik, D. Chidambarrao, M.A. Korhonen, T.M. Shaw, R. Rosenberg, and T.D. Sullivan, "The electromigration short-length effect in AlCu and Cu interconnects". AIP Conference Proceedings, 2002. 612(Stress-Induced Phenomena in Metallization): p. 33-48.
-
(2002)
AIP Conference Proceedings
, vol.612
, pp. 33-48
-
-
Filippi, R.G.1
Wang, P.C.2
Wachnik, R.A.3
Chidambarrao, D.4
Korhonen, M.A.5
Shaw, T.M.6
Rosenberg, R.7
Sullivan, T.D.8
-
7
-
-
0037474942
-
Electromigration reliability of dual-damascene Cu/porous methylsilsesquioxane low-k interconnects
-
Lee, K.-D., E.T. Ogawa, S. Yoon, X. Lu, and P.S. Ho, " Electromigration reliability of dual-damascene Cu/porous methylsilsesquioxane low-k interconnects". Applied Physics Letters, 2003. 82(13): p. 2032-2034.
-
(2003)
Applied Physics Letters
, vol.82
, Issue.13
, pp. 2032-2034
-
-
Lee, K.-D.1
Ogawa, E.T.2
Yoon, S.3
Lu, X.4
Ho, P.S.5
-
8
-
-
0034317840
-
Influence of underlying interlevel dielectric films on extrusion formation in aluminum interconnects
-
Chen, F., B. Li, T.D. Sullivan, C.L. Gonzalez, C.D. Muzzy, H.K. Lee, M.D. Levy, M.W. Dashiell, and J. Kolodzey, "Influence of underlying interlevel dielectric films on extrusion formation in aluminum interconnects". Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures, 2000. 18(6): p. 2826-2834.
-
(2000)
Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures
, vol.18
, Issue.6
, pp. 2826-2834
-
-
Chen, F.1
Li, B.2
Sullivan, T.D.3
Gonzalez, C.L.4
Muzzy, C.D.5
Lee, H.K.6
Levy, M.D.7
Dashiell, M.W.8
Kolodzey, J.9
-
9
-
-
0033698147
-
Step and flash imprint lithography for sub-100-nm patterning
-
(Emerging Lithographic Technologies IV)
-
Colbum, M., A. Grot, M.N. Amistoso, B.J. Choi, T.C. Bailey, J.G. Ekerdt, S.V. Sreenivasan, J. Hollenhorst, and C.G. Willson, "Step and flash imprint lithography for sub-100-nm patterning". Proceedings of SPIE-The International Society for Optical Engineering, 2000. 3997(Emerging Lithographic Technologies IV): p. 453-457.
-
(2000)
Proceedings of SPIE-The International Society for Optical Engineering
, vol.3997
, pp. 453-457
-
-
Colbum, M.1
Grot, A.2
Amistoso, M.N.3
Choi, B.J.4
Bailey, T.C.5
Ekerdt, J.G.6
Sreenivasan, S.V.7
Hollenhorst, J.8
Willson, C.G.9
-
11
-
-
0542428710
-
Formation of cagelike intermediates from nonrandom cyclization during Acid-catalyzed sol-gel polymerization of tetraethyl orthosilicate
-
Ng, L.V., P. Thompson, J. Sanchez, C.W. Macosko, and A.V. McCormick, "Formation of Cagelike Intermediates from Nonrandom Cyclization during Acid-Catalyzed Sol-Gel Polymerization of Tetraethyl Orthosilicate". Macromolecules, 1995. 28(19): p. 6471-6.
-
(1995)
Macromolecules
, vol.28
, Issue.19
, pp. 6471-6476
-
-
Ng, L.V.1
Thompson, P.2
Sanchez, J.3
Macosko, C.W.4
McCormick, A.V.5
-
12
-
-
0000580309
-
Silsesquioxanes as synthetic platforms. 3. Photocurable, liquid epoxides as inorganic/organic hybrid precursors
-
Sellinger, A. and R.M. Laine, "Silsesquioxanes as Synthetic Platforms. 3. Photocurable, Liquid Epoxides as Inorganic/Organic Hybrid Precursors". Chemistry of Materials, 1996. 8(8): p. 1592-1593.
-
(1996)
Chemistry of Materials
, vol.8
, Issue.8
, pp. 1592-1593
-
-
Sellinger, A.1
Laine, R.M.2
-
13
-
-
0002717274
-
Physical and mechanical properties determination of photo-BCB-based thin films
-
(Microelectronics)
-
Im, J., E.O. Shaffer, R. Peters, T. Rey, C. Murlick, and R.L. Sammler, "Physical and mechanical properties determination of photo-BCB-based thin films". Proceedings of SPIE-The International Society for Optical Engineering, 1996. 2920(Microelectronics): p. 168-175.
-
(1996)
Proceedings of SPIE-The International Society for Optical Engineering
, vol.2920
, pp. 168-175
-
-
Im, J.1
Shaffer, E.O.2
Peters, R.3
Rey, T.4
Murlick, C.5
Sammler, R.L.6
-
14
-
-
0032625408
-
Step and flash imprint lithography: A new approach to high-resolution patterning
-
(Pt. 1, Emerging Lithographic Technologies III)
-
Colbum, M., S. Johnson, M. Stewart, S. Damle, T.C. Bailey, B. Choi, M. Wedlake, T. Michaelson, S.V. Sreenivasan, J. Ekerdt, and C.G. Willson, "Step and flash imprint lithography: a new approach to high-resolution patterning". Proceedings of SPIE-The International Society for Optical Engineering, 1999. 3676(Pt. 1, Emerging Lithographic Technologies III): p. 379-389.
-
(1999)
Proceedings of SPIE-The International Society for Optical Engineering
, vol.3676
, pp. 379-389
-
-
Colbum, M.1
Johnson, S.2
Stewart, M.3
Damle, S.4
Bailey, T.C.5
Choi, B.6
Wedlake, M.7
Michaelson, T.8
Sreenivasan, S.V.9
Ekerdt, J.10
Willson, C.G.11
-
15
-
-
0141836181
-
Imprint lithography: Lab curiosity or the real NGL
-
(Pt. 1, Emerging Lithographic Technologies VII)
-
Resnick, D.J., W.J. Dauksher, D.P. Mancini, K.J. Nordquist, T.C. Bailey, S.C. Johnson, N.A. Stacey, J.G. Ekerdt, C.G. Willson, S.V. Sreenivasan, and N.E. Schumaker, "Imprint lithography: lab curiosity or the real NGL". Proceedings of SPIE-The International Society for Optical Engineering, 2003. 5037(Pt. 1, Emerging Lithographic Technologies VII): p. 12-23.
-
(2003)
Proceedings of SPIE-The International Society for Optical Engineering
, vol.5037
, pp. 12-23
-
-
Resnick, D.J.1
Dauksher, W.J.2
Mancini, D.P.3
Nordquist, K.J.4
Bailey, T.C.5
Johnson, S.C.6
Stacey, N.A.7
Ekerdt, J.G.8
Willson, C.G.9
Sreenivasan, S.V.10
Schumaker, N.E.11
-
16
-
-
84866740588
-
On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique
-
Zhao, J.-H., T. Ryan, P.S. Ho, A.J. McKerrow, and W.-Y. Shih, "On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique". Journal of Applied Physics, 2000. 88(5): p. 3029-3038.
-
(2000)
Journal of Applied Physics
, vol.88
, Issue.5
, pp. 3029-3038
-
-
Zhao, J.-H.1
Ryan, T.2
Ho, P.S.3
McKerrow, A.J.4
Shih, W.-Y.5
-
17
-
-
24644474741
-
Simulation of fluid flow in the step and flash imprint lithography process
-
Reddy, S. and R.T. Bonnecaze, "Simulation of fluid flow in the step and flash imprint lithography process". Microelectronic Engineering, 2005. 82(1): p. 60-70.
-
(2005)
Microelectronic Engineering
, vol.82
, Issue.1
, pp. 60-70
-
-
Reddy, S.1
Bonnecaze, R.T.2
-
18
-
-
31144438014
-
Dynamics of low capillary number interfaces moving through sharp features
-
Reddy, S., P.R. Schunk, and R.T. Bonnecaze, "Dynamics of low capillary number interfaces moving through sharp features". Physics of Fluids, 2005. 17(12): p. 122104/1-122104/6.
-
(2005)
Physics of Fluids
, vol.17
, Issue.12
-
-
Reddy, S.1
Schunk, P.R.2
Bonnecaze, R.T.3
|