Thermal effects study of chemically amplified resist

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6153 II, Issue , 2006, Pages

  Kim, Sang Kon ^a  

^a The Catholic University of Korea   (South Korea)

Author keywords

Chemically amplified resist; Lithography; Lithography simulation; Post Exposure bake; Soft bake; Thermal process; Thermal reflow

Indexed keywords

COMPUTER SIMULATION; LITHOGRAPHY; PROCESS CONTROL; THERMAL EFFECTS;

CHEMICALLY AMPLIFIED RESISTS; LITHOGRAPHY SIMULATION; POST EXPOSURE BAKE; SOFT BAKE; THERMAL PROCESSES; THERMAL REFLOW;

PHOTORESISTS;

EID: 33745603770     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.656174     Document Type: Conference Paper

References (8)

1. P. Zandbergen, D. V. Steenwinckel, J. H. Lammers, H. Kwinten and C. Juffermans, "Process Extensions in Optical Lithography Enabling 45-nm Technologies," IEEE Trans. On Semi. Manufac. 18, 1, 37 (2005)
2. J. Byers, M. Smith and C. Mack, "Modeling Soft Bake Effects in Chemically Amplified Resists," SPIE 5039, 1143 (2003).
3. S-K. Kim and H-K Oh, "Bulk Image Formation of Scalar Modeling in a Photoresist," J. Korean Phys. Soc. 41, 4, 456 (2002).
4. S-K. Kim, H-K. Oh, I. An and S-M. Lee, C-K. Bok and S-C. Moon, "Bulk Effects of Thermal Flow Resists," J. Korean Phy. Soc. 46, 6, 1439 (2005).
5. Y-S. Sohn, H-K. Oh and I. An, "Parameter Extraction for 193 nm Chemically Amplified Resist from Refractive Index Change," J. Vac. Sci. Technol. B 19, 2077 (2001).
6. S-K. Kim, Optical Rev. "Exposure Simulation Model for Chemically Amplified Resist," 10, 4, 335 (2003).
7. S-K. Kim, I. An, H-K. Oh, S.M. Lee, C.K. Bok, and S.C. Moon, "Simulation of Thermal Resist Process," SPIE 5753, 1186(2005).
8. S-K. Kim and H-K. Oh, "Simulator for Resist-Reflow Process by Boundary Movement," J. Korean Phys. Soc. 45, S736 (2004).