Simulation of thermal resist flow process

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5753, Issue II, 2005, Pages 1186-1193

  Kim, Sang Kon ^a   An, Ilsin ^a   Oh, Hye Keun ^a   Lee, Sun Muk ^b   Bok, Cheol Kyu ^c   Moon, Seung Chan ^c  

^a Hanyang University   (South Korea)

^b Seoul National University   (South Korea)

^c Hynix Semiconductor Inc   (South Korea)

Author keywords

Chemically amplified resist; Lithography; Lithography simulation; Thermal process

Indexed keywords

COMPUTER SIMULATION; CONTACT ANGLE; COSTS; OPTICAL RESOLVING POWER; PHOTOLITHOGRAPHY; PROBLEM SOLVING; SHRINKAGE; THERMAL EFFECTS;

CHEMICALLY AMPLIFIED RESISTS; FLOW PROCESS; LITHOGRAPHY SIMULATION; THERMAL PROCESS; THERMAL RESIST;

PHOTORESISTS;

EID: 24644438122     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.600699     Document Type: Conference Paper

References (6)

1. J.-S. Kim, C.-W. Koh, G. Lee, J.-C. Jung and K.-S. Shin, SPIE 4345, 232 (2001).
2. E. Baylac, C. Brault, J.-W. Sung, SPIE 4691, 1513 (2002).
3. Z.-K. Hsiau, E. C. Kan, J. P. McVittie and R. W. Dutton, IEEE Trans. On Electron Devices, 44, No. 9, 1375 (1997).
4. Sang-Kon Kim and Hye-Keun Oh, J. Korean Phy. Soc. 41, No. 4, 456 (2002).
5. Sang-Kon Kim, J. Korean Phy. Soc. 42, S371 (2003).
6. E.-J. Seo, H.-J. Bak, S.-K. Kim, Y.-S. Sohn and H.-K. Oh, J. Korean Phys. Soc. 40, No. 4, 725 (2002).