A model of Cu-CMP

Materials Research Society Symposium Proceedings

Volumn 816, Issue , 2004, Pages 55-61

  Paul, Ed ^a   Brusic, Vlasta ^b   Sun, Fred ^b   Zhang, Jian ^b   Vacassy, Robert ^b   Kaufman, Frank ^b  

^a RICHARD STOCKTON COLLEGE OF NEW JERSEY   (United States)

^b CABOT MICROELECTRONICS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; ASYMPTOTIC STABILITY; COPPER; ETCHING; HYDROGEN PEROXIDE; OXIDATION; SLURRIES;

LIGANDS; REMOVAL RATE; SCHEMATIC DIAGRAM; SURFACE KINETICS;

CHEMICAL MECHANICAL POLISHING;

EID: 12744269987     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-816-k2.2     Document Type: Conference Paper

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