Impact of gaseous additives on copper CMP in neutral and alkaline solutions using a CAP system

Journal of the Electrochemical Society

Volumn 152, Issue 11, 2005, Pages

  Denardis, Darren ^a   Doi, Toshiro ^a,b   Hiskey, Brent ^a   Ichikawa, Koichiro ^c   Ichikawa, Daizo ^c   Philipossian, Ara ^a,d  

^a University of Arizona   (United States)

^b SAITAMA UNIVERSITY   (Japan)

^c Fujikoshi Machinery Corporation   (Japan)

^d ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ALKALINITY; COPPER; DISSOLUTION; NITROGEN; OXIDATION; PARTIAL PRESSURE; PH EFFECTS; SOLUTIONS; SURFACE CHEMISTRY;

ABRADED MATERIALS; ALKALINE SOLUTIONS; CONTROLLED ATMOSPHERE POLISHING (CAP); GASEOUS ADDITIVES;

CHEMICAL MECHANICAL POLISHING;

EID: 27944478662     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2042908     Document Type: Article

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