A study of impact performance of conductive adhesives

International Journal of Adhesion and Adhesives

Volumn 24, Issue 5, 2004, Pages 449-453

  Rao, Yang ^a   Lu, Daoqiang ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Conductive adhesives; Constrained layer damping theory; Drop impact test; Impact resistance; Lead free solder; Modal analysis; Natural vibration frequencies

Indexed keywords

ADHESION; ELECTRIC CONDUCTIVITY; FINITE ELEMENT METHOD; IMPACT RESISTANCE; MATHEMATICAL MODELS; MODAL ANALYSIS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

CONDUCTIVE ADHESIVES; CONSTRAINED LAYER DAMPING THEORY; DROP IMPACT TESTS; LEAD FREE SOLDERS; NATURAL VIBRATION FREQUENCIES;

ADHESIVES;

ADHESION; ADHESIVES; DAMPING; FINITE ELEMENT ANALYSIS; MATHEMATICAL MODELS; RESISTIVITY; SOLDERING; VIBRATION;

EID: 2442682020     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2003.12.003     Document Type: Article

References (13)

1. Alpert BT, Schoenberg AJ. Conductive adhesives as a soldering alternative. Electron Packag Prod 1991; 130-2.
2. Cdenhead R., DeCoursey D. Int J Microelectron. 8(3):1985;14.
3. Nguyen G, Williams J, Gibson F, Winster T. Electrical reliability of conductive adhesives for surface mount applications. Proceedings of International Electronic Packaging Conference, 1993. p. 479-86.
4. Zwolinski M, Hickman J, Rubon H, Zaks Y. Electrically conductive adhesives for surface mount solder replacement. Proceedings of the Second International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, Sweden; June 3-5, 1996. p. 333-40.
5. Smith-Vargo L. Adhesives that posses a science all their own. Electron Packag Prod 1986; 48-9.
6. Corbett S, Dominano MJ. Processing with polymer solders. Surf Mount Technol 1997; 48-52.
7. Zwolinski M, Hickman J, Rubon H, Zaks Y. Electrically conductive adhesives for surface mount solder replacement. Proceedings of the Second International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, Sweden; June 3-5, 1996. p. 333-40.
8. Macathy S. Proceedings of Surface Mount International, San Jose; August 27-31, 1995. p. 562-7.
9. Vona SA, Tong QK. Surface mount conductive adhesives with superior impact resistance. Proceedings of Fourth International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, GA; March 14-16, 1998. p. 261-7.
10. Maia NMM, Montalvao JM. Theoretical and experimental modal analysis. Taunton, Somerset, England, New York: Research Studies Press; 1997.
11. Gawronski, Wodek Dynamics and control of structures. a modal approach:1998;Springer, New York.
12. Nashif A.D., Jones D.I.G., Henderson J.P. Vibration damping. 1985;Wiley, New York.
13. Osinski Z. Damping of vibrations. 1998;A.A. Balkema, Rotterdam; Brookfield.