Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology

Journal of Micromechanics and Microengineering

Volumn 16, Issue 7, 2006, Pages 1349-1357

  Gu, Lei ^a   Li, Xinxin ^a   Bao, Haifei ^a   Liu, Bin ^a   Wang, Yuelin ^a   Liu, Min ^a   Yang, Zunxian ^a   Cheng, Baoluo ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; BORON; CRYSTALLINE MATERIALS; ELECTROSTATICS; ETCHING; IONS; NANOTECHNOLOGY; SILICON WAFERS;

ION ETCHING; MICROMACHINING TECHNOLOGY; NANO-INDENTING EXPERIMENT; POLYMETHYL METHACRYLATE FILMS;

MICROMACHINING;

EID: 33745069306     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/7/032     Document Type: Article

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