Integrated bulk-micromachined gyroscope using deep trench isolation technology

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 605-608

  Yan, Guizhen ^a   Zhu, Yong ^a   Wang, Chengwei ^a   Zhang, Rong ^b   Chen, Zhiyong ^b   Liu, Xuesong ^a   Wang, Y Y ^a  

^a PEKING UNIVERSITY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ATMOSPHERIC PRESSURE; CMOS INTEGRATED CIRCUITS; ETCHING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SILICON WAFERS; SINGLE CRYSTALS; TRENCHING;

ELECTRICAL ISOLATION MATERIALS; INTEGRATED GYROSCOPES; MICROMACHINED SENSORS; TRENCH ISOLATION;

GYROSCOPES;

EID: 3042698431     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. K.Maenaka, and T.Shiozawa, "Silicon rate sensor using anisotropic etching technology", Tech.Digest of the 7th Int. Conf. on Solid-State Sensors and Acuators: Transducers 93, Yokohama, Japan, June 7-10, 1993, pp.642-645.
3. Zhihong Li, Zhenchuan Yang, and Zhixiong Xiao, "A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching", Sensors and Actuators 83(2000) 24-29.
4. J.A.Geen, S.J.Sherman, J.F.Chang and S.R.Lewis, IEEE J.Solid-State Circuits, Vol.37, No.12, 2002, pp1860-1866.
5. M. Palaniapan, R. T. Howe and J. Yasaitis, Proc. MEMS 2003, pp. 482-485.
6. H. K. Xie, X. Zhu, K. J. Gabriel and G. K. Fedder, J MEMS, Vol.11, No.2, 2002, pp 93-101.