Assessment of long-term reliability in lead-free assemblies

Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC

Volumn 2005, Issue , 2005, Pages 140-155

  Ganesan, Sanka ^a   Wu, Ji ^a   Pecht, Michael ^a   Lee, Ricky ^b   Lo, Jeffery ^b   Fu, Yun ^c   Li, Yonghong ^c   Xu, Ming ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^c Aero Combined Environment Laboratory   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FR4; POLYIMIDE; SMT ASSEMBLIES; THERMO-MECHANICAL LOADING;

ELECTRONIC EQUIPMENT; INTERMETALLICS; LEAD; POLYCHLORINATED BIPHENYLS; POLYIMIDES; PRODUCT DESIGN; RELIABILITY;

SOLDERED JOINTS;

EID: 33744993651     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AGEC.2005.1452334     Document Type: Conference Paper

References (20)

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