Cyclic mechanical durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag lead-free solder alloys

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn , Issue , 2002, Pages 99-104

  Zhang, Qian ^a   Dasgupta, Abhijit ^a   Haswell, Peter ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b JDS Uniphase Corporation   (United States)

Author keywords

Cyclic mechanical durability; Energy partitioning; Lead free solder; Thermal cycling test

Indexed keywords

ALLOYS; CERIUM ALLOYS; COPPER ALLOYS; DURABILITY; EUTECTICS; MECHANICAL ENGINEERING; SILVER; SILVER ALLOYS; STRAIN RATE; TESTING; THERMAL CYCLING; TIN; TIN ALLOYS;

DAMAGE MODEL; ENERGY-PARTITIONING; EUTECTIC ALLOYS; HIGH LOAD; INELASTIC STRAIN; LEAD-FREE ALLOY; LEAD-FREE SOLDER; LEAD-FREE SOLDER ALLOY; LOAD LEVELS; LOW LOAD; MECHANICAL CYCLING; MECHANICAL DURABILITY; MECHANICAL TESTS; MICRO-STRUCTURAL; POWER-LAW; ROOM TEMPERATURE; SN-3.5AG; SN-3.5AG LEAD-FREE SOLDERS; SN-37PB; SN3.5AG SOLDER; TEST CONDITION; TEST SYSTEMS; THERMAL CYCLING TEST; THERMO-MECHANICAL;

MECHANICAL PROPERTIES;

EID: 78249240914     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-39250     Document Type: Conference Paper

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