Simulation of a coupled signal and power delivery system in an electronics package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 311-318

  Qi, Quan ^a   Quint, David ^a   Michalka, Tim ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; CROSSTALK; FREQUENCIES; MICROPROCESSOR CHIPS; TIME DOMAIN ANALYSIS;

COUPLED SIGNALS;

ELECTRONICS PACKAGING;

EID: 0036297056     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer system
2. Optimizing the package design with electrical modeling and simulation
3. Modeling the power rails in leading edge microprocessor packages
4. The digital designer's complete lossy transmission line model