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Volumn 2, Issue , 2004, Pages 583-587

Via and reference discontinuity impact on high-speed signal integrity

Author keywords

Noise coupling; Refrence discontinuity; Via transition

Indexed keywords

BOUNDARY CONDITIONS; DIGITAL CIRCUITS; ELECTRIC IMPEDANCE; ELECTRIC POTENTIAL; ELECTROMAGNETIC FIELDS; FINITE DIFFERENCE METHOD; METALLIZING; METHOD OF MOMENTS; SPURIOUS SIGNAL NOISE; STANDBY POWER SYSTEMS; SWITCHING SYSTEMS; TIME DOMAIN ANALYSIS;

EID: 4644318460     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (10)

References (11)
  • 2
    • 0036385145 scopus 로고    scopus 로고
    • Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB
    • 19-23 Aug.
    • Jiunn-Nan Hwang; Tzong-Lin Wu, "Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB", Electromagnetic Compatibility, 2002 IEEE International Symposium on, Vol.2, 19-23 Aug. 2002
    • (2002) Electromagnetic Compatibility, 2002 IEEE International Symposium on , vol.2
    • Hwang, J.-N.1    Wu, T.-L.2
  • 6
    • 0036297056 scopus 로고    scopus 로고
    • Simulation of a coupled signal and power delivery system in an electronics packages
    • 28-31 May
    • Quan Qi, David Quint, and Tim Michalka, "Simulation of a Coupled Signal and Power Delivery System in an Electronics Packages", Electronic Components and Technology Conference, 28-31 May 2002, pp. 311-318
    • (2002) Electronic Components and Technology Conference , pp. 311-318
    • Qi, Q.1    Quint, D.2    Michalka, T.3
  • 7
    • 84954073469 scopus 로고    scopus 로고
    • Analytical model of power/ground noise coupling to signal traces in high-speed multi-layer packages or boards
    • 10- 12 Dec.
    • Jingook Kim, Mihai Dragos Rotaru, Junwoo Lee, Jongbae Park, Popov Alexander, Mahadevan K. Iyer, and Joungho Kim, "Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-Speed Multi-Layer Packages or Boards", 5th Electronics Packaging Technology Conference, 10- 12 Dec. 2003, pp. 45-50.
    • (2003) 5th Electronics Packaging Technology Conference , pp. 45-50
    • Kim, J.1    Rotaru, M.D.2    Lee, J.3    Park, J.4    Alexander, P.5    Iyer, M.K.6    Kim, J.7
  • 8
    • 0038688708 scopus 로고    scopus 로고
    • Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages
    • New Orleans, USA, May
    • Junwoo Lee, Yeo Mui Seng, Mihai Dragos Rotaru, Mahadevan K Iyer, and Joungho Kim, "Characterization of High-Frequency Plane-to-Plane Coupling through Cutout in Multi-Layer Packages", Elcecronic Components and Technology Conference, New Orleans, USA, May 2003, pp. 1589-1593
    • (2003) Elcecronic Components and Technology Conference , pp. 1589-1593
    • Lee, J.1    Seng, Y.M.2    Rotaru, M.D.3    Iyer, M.K.4    Kim, J.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.