Quantitative analysis of observations on diffusion induced grain boundary migration for random boundaries in the Cu(Zn) system using a driving force model

Acta Materialia

Volumn 47, Issue 4, 1999, Pages 1195-1201

  Yamamoto, Y ^a   Kajihara, M ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; BINARY ALLOYS; DIFFUSION IN SOLIDS; ENTHALPY; GRAIN BOUNDARIES; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS; RANDOM PROCESSES; THERMAL EFFECTS;

CHEMICAL DRIVING FORCE MODEL; ENERGY BALANCE MODEL; GRAIN BOUNDARY MIGRATION; VOLUME DIFFUSION;

COPPER ALLOYS;

EID: 0032673047     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(98)00426-1     Document Type: Article

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