Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K

Materials Science and Engineering: A

Volumn 333, Issue 1-2, 2002, Pages 262-269

  Yamamoto, Y ^a   Uemura, S ^a   Yoshida, K ^a   Kajihara, M ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Diffusion induced recrystallization; Grain boundary migration; Grain growth

Indexed keywords

ANNEALING; BINARY ALLOYS; CRYSTALLIZATION; DIFFUSION; GRAIN GROWTH; REACTION KINETICS;

RECRYSTALLISATION;

COPPER ALLOYS;

CRYSTALLIZATION;

EID: 0036680375     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(01)01847-0     Document Type: Article

References (19)