Numerical analysis of observations on diffusion induced recrystallization in the Ni(Cu) system using a kinetic model

Materials Transactions

Volumn 42, Issue 8, 2001, Pages 1763-1770

  Yamamoto, Y ^a   Kajihara, M ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Diffusion induced recrystallization; Grain boundary diffusion; Grain boundary migration; Grain growth; Nickel copper system

Indexed keywords

CRYSTAL GROWTH; DIFFUSION IN SOLIDS; DRAG; FRICTION; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; REACTION KINETICS; RECRYSTALLIZATION (METALLURGY); THERMAL EFFECTS;

BOUNDARY DIFFUSION MODEL; COLUMNAR GEOMETRY DIFFUSION MODEL; DIFFUSION INDUCED RECRYSTALLIZATION; ENERGY BALANCE MODEL; FRICTION FORCE; GRAIN BOUNDARY DIFFUSION; GRAIN BOUNDARY MIGRATION; SOLUTE; VOLUME DIFFUSION;

NICKEL ALLOYS;

EID: 0034771816     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.42.1763     Document Type: Article

References (21)